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Stealth Laser Dicing
It is a dicing method that forms a modified layer in the wafer, by focusing a laser inside the wafer, and then implements die separation with a machine such as a tape expander.
Widely used for MEMS, RFID,Image sensor...etc.
Stealth laser dicing advantages:
1. Completely dry process dicing
2. Dust-free dicing
3. More than 4 times faster compare to blade dicing
4. Zero Kerf-loss
5. Better die strength
6. Able to cut for ultra thin wafer directly
7. No ESD damage
Wuxi Creative Sensor
Line:+86-510-85342588-666
E-mail:lizheng@csi-sensor.com.cn |
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